d a t a sh eet product speci?cation file under ferrite ceramics, ma01 1999 dec 23 ferrite ceramics iic10p-14/4 iic10-14/4 integrated inductive components
1999 dec 23 2 philips components product speci?cation integrated inductive components iic10p-14/4 iic10p-14/4 effective core parameters features inductive smd component that looks like a standard ic. windings are completed by pcb tracks. suitable for reflow soldering. partial air gap to resist saturation. number of turns can be adpated by track layout. applications power inductor output choke emi choke with bias current. symbol parameter value unit s (i/a) core factor (c1) 2.47 mm - 1 v e effective volume 338 mm 3 i e effective length 28.9 mm a e effective area 11.7 mm 2 m mass of core half ? 1.85 g fig.1 iic10p-14/4 outline. dimensions in mm. handbook, halfpage 0.1 14.4 0.2 4 0.08 7.2 0.15 10.45 max. 1.0 0.6 max. 0.3 4.38 max. 0.3 max. 0.75 0.75 2.7 0.2 cbw368 iics with partial air gap for use as power inductors iics with partial air gap under power conditions grade l ( m h) for 10 turns no bias current l ( m h) for 10 turns with a bias current of 1 a type number f = 100 khz; t=25 c f = 500 khz; t=25 c f = 1 mhz; t=25 c f = 100 khz; t=25 c f = 500 khz; t=25 c f = 1 mhz; t=25 c 3c30 92 25% --3 5 -- iic10p-14/4-3c30 3f4 -- 45 25% --3 5 iic10p-14/4-3f4 3f35 - 70 25% --3 5 - iic10p-14/4-3f35 grade core loss (mw) type number f = 100 khz; = 100 mt; t = 100 c f = 500 khz; =50mt; t = 100 c f = 1 mhz; =30mt; t = 100 c 3c30 30 -- iic10p-14/4-3c30 3f4 -- 70 iic10p-14/4-3f4 3f35 - 40 - iic10p-14/4-3f35 b ? b ? b ?
1999 dec 23 3 philips components product speci?cation integrated inductive components iic10-14/4 iic10-14/4 effective core parameters features inductive smd component that looks like a standard ic. windings are completed by pcb tracks. suitable for reflow soldering. several magnetic functions, depending on track layout. applications common-mode choke mutli-line choke power transformers signal transformers saturable inductor. symbol parameter value unit s (i/a) core factor (c1) 2.47 mm - 1 v e effective volume 338 mm 3 i e effective length 28.9 mm a e effective area 11.7 mm 2 m mass of core half ? 1.85 g fig.2 iic10-14/4 outline. dimensions in mm. handbook, halfpage 0.1 14.4 0.2 4 0.08 7.2 0.15 10.45 max. 1.0 0.6 max. 0.3 4.38 max. 0.3 max. 0.75 0.75 2.7 0.2 cbw369 iics for use as transformer or common-mode chokes iic for use as a common-mode choke or multi-line choke note 1. minimum value, ? z ? min is - 20%. iic with rectangular hysteresis loop for use in magnetic regulators grade a l (nh) at core loss (mw) type number f = 10 khz; t=25 c f = 500 khz; t=25 c f=1mhz; t=25 c f = 500 khz; = 50 mt; t = 100 c f = 1 mhz; = 30 mt; t = 100 c 3f4 -- 450 25% - 70 iic10-14/4-3f4 3e6 6000 30% -- - - iic10-14/4-3e6 3f35 - 700 25% - 40 - iic10-14/4-3f35 grade ? z ?w for 1 turn at f = 100 mhz; t = 25 c (1) type number 3s4 ? 35 iic10-14/4-3s4 grade e t product (v. m s) at type number f = 100 khz; h = 800 a/m; t = 100 c; i reset = 70 ma; 10 turns f = 100 khz; h = 800 a/m; t = 100 c; i reset = 0 ma; 10 turns 3r1 3 33 12 iic10-14/4-3r1 b ? b ?
1999 dec 23 4 philips components product speci?cation integrated inductive components iic10-14/4 general data r dc ? 65 m w (25 c) and ? 85 m w (100 c) for 10 turns including 20 solder joints (assuming 70 m m cu pcb tracks). leadframe material copper, plated with tin-lead alloy snpb (85/15). solderability compatible with reflow soldering, iec 60068-2-58, part 2, test ta, method 1. moulding material liquid crystal polymer (lcp), flame retardant in accordance with ul 94v-0. isolation voltage >500 v (dc) between leads and between leads and ferrite core. isolation resistance >100 m w between leads. inter winding capacitance 2 windings of 5 turns: unifilar ? 5pf bifilar ? 10 pf. (depending on track layout; see figs 1 and 2) leakage inductance 2 windings of 5 turns: unifilar ? 1.8 m h bifilar ? 0.2 m h. maximum continuous current (dc) 4 a (depending on copper track thickness on pcb). maximum peak current 10 a. n dbook, 4 columns remove for use as 5+5 turns cbw541 fig.3 unifilar track pattern. n dbook, 4 columns cbw540 fig.4 bifilar track pattern.
1999 dec 23 5 philips components product speci?cation integrated inductive components iic10p-14/4 iic10-14/4 mounting soldering information r ecommended solder lands fig.5 recommended temperature profile for reflow soldering. 300 215 to 280 c 200 180 c 160 c max. 100 0 t (s) 60 s min. preheating 100 s max. soldering 10 s max. natural cooling 1 minute max. a = 10 k/s max. ccb814 fig.6 recommended solder lands handbook, full pagewidth solder paste solder lands clearance 1.0 0.9 0.6 0.5 1.1 1.4 8.15 10.95 ccb815
1999 dec 23 6 philips components product speci?cation integrated inductive components iic10p-14/4 iic10-14/4 packaging tape and reel speci?cations all tape and reel specifications are in accordance with the second edition of iec 60286-3 . basic dimensions are given in figs 7 and 8, and table 1. blister tape table 1 dimensions of blister tape; see fig.7 note 1. p 0 pitch tolerance over any 10 pitches is 0.2 mm. symbol dimensions tol. unit a 0 10.6 0.1 mm b 0 14.75 0.1 mm k 0 4.75 0.1 mm w24 0.3 mm d 0 1.5 0.1 mm d 1 1.5 0.25 mm p 0 ; note 1 4 0.1 mm p 1 12 0.1 mm p 2 6 0.1 mm t 0.3 0.1 mm k 0: chosen so that the orientation of the component cannot change. for dimensions see table 1. fig.7 blister tape. handbook, full pagewidth ccb842 w p 2 p 0 d 0 b 0 a 0 d 1 p 1 direction of unreeling k 0 t cover tape
1999 dec 23 7 philips components product speci?cation integrated inductive components iic10p-14/4 iic10-14/4 reel speci?cations packaging quantities iics are delivered taped and reeled in quantities of 1000 units. storage requirements these storage requirements should be observed in order to ensure the soldering of the exposed electrode: maximum ambient temperature shall not exceed 40 c. storage temperature higher than 40 c could result in the deformation of packaging materials. maximum relative humidity recommended for storage is 70% rh. high humidity with high temperature can accelerate the oxidation of the tin-lead plating on the termination and reduce the solderability of the components. products shall not be stored in environments with the presence of harmful gases containing sulfur or chlorine. fig.8 reel. handbook, full pagewidth 12.75 + 0.15 0 20.5 100 5 330 2 < 28.4 ccb816 dimensions in mm.
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